jbas
Synthesis, Characterization, In-Vitro Antimicrobial and Antioxidant Activities of Co+2, Ni+2, Cu+2 and Zn+2 Complexes of 3-(2-(2-hydroxy-3-methoxybenzylidene)hydrazono)indolin-2-one DOI: http://dx.doi.org/10.6000/1927-5129.2015.11.17 Published: 23 February 2015 |
Abstract: Four novel complexes of “3-(2-(2-hydroxy-3-methoxybenzylidene)hydrazono)indolin-2-one” have been synthesized with Co+2, Ni+2, Cu+2 and Zn+2. Physical and analytical techniques including CHN, IR, UV-Vis, AAS, molar conductivity values and magnetic susceptibility data were used to characterize all complexes. The bis Schiff base ligand i.e. 3-(2-(2-hydroxy-3-methoxybenzylidene)hydrazono)indolin-2-one, acted as a tridentate ligand and coordinated through phenolic oxygen, azomethine nitrogen and carbonyl group. Low values of molar conductance suggested the non-electrolyte nature of all complexes. Elemental analysis of complexes indicated the 1:1 metal to ligand mole ratios for [Cu(Inh)(OAc)] and [Zn(Inh)(OAc)] metal complexes and 1:2 metal to ligand mole ratios for [Co(Inh)2] and [Ni(Inh)2] metal complexes. Square planner geometry is proposed for [Cu(Inh)(OAc)] and distorted tetrahedral geometry is proposed for [Zn(Inh)(OAc)] while octahedral geometries are proposed for [Co(Inh)2] and [Ni(Inh)2] metal complexes. Antimicrobial and antioxidant studies were performed for all compounds and it was discovered that the complexes are more potent antibacterial and antifungal agents while the ligand exhibited comparatively more DPPH (1,1-diphenyl-2-picryl-hydrazil) radical scavenging activity than the complexes. Keywords: Bis Schiff base, Transition metal complexes, Antimicrobial, Antioxidant. Download Full Article |
Techniques to Identify and Test PCB Faults with Proposed Solution Ambreen Insaf, Mirza Salman Baig, Zeeshan Alam Nayyar and Mirza Aman Baig DOI: http://dx.doi.org/10.6000/1927-5129.2014.10.71 Published: 18 December 2014 |
Abstract: Printed Circuit Boards (PCBs) are getting more complex day by day because of vast and modern technology. Analyzing PCB’s failure and their reason of failing is a challenging task but despite how faulty they may be, they can be diagnosed and repair. Modern PCBs consist of fine pitch components including unidentified, non-testable and customized parts, which make it difficult to troubleshoot and repair. Modern PCBs cannot test and repair using generic Automatic Test Equipments (ATEs), unlike simple ones. Successful repair of such types of PCBs is an art more than science. PCB troubleshooting and fault analysis needs a good theoretical knowledge and analytical thinking. It is not something, which can only study from books, but it can gain through constant troubleshooting and experiencing. Keeping in view above mentioned problems this research focused on exploring diagnosis skills and techniques used to identify faults in such Integrated Circuits (ICs) and components using VI instrument. As a result, reducing equipment downtime and high costs need in PCB repairs. Keywords: Troubleshoot and repair, VI instrument, customized components, Printed Circuit Board (PCB), defective component. Download Full Article |
Ambreen Insaf, Mirza Salman Baig, Zeeshan Alam Nayyar and Mirza Aman Baig